Technical Specifications:
- Material Composition:
- Primary Ingredient: Silver (Ag), typically >70–85% by weight for optimal conductivity.
- Binder Material: Organic or polymer-based for adhesion and flexibility.
- Solvent: Designed for controlled evaporation during curing.
- Thermal Properties:
- Curing Temperature: 80°C (low-temperature surface curing for sensitive substrates).
- Curing Time: Typically 15–60 minutes, depending on the layer thickness and substrate.
- Thermal Conductivity: High, typically ~200–400 W/m·K.
- Operating Temperature Range: -40°C to 200°C (varies by formulation).
- Electrical Properties:
- Volume Resistivity: ~10⁻⁴ to 10⁻⁵ Ω·cm, providing excellent electrical conductivity.
- Viscosity: Adjustable for specific applications such as screen printing, brushing, or syringe dispensing.
Applications:
- Electronics Assembly:
- Purpose: Creates conductive pathways for connecting electronic components.
- Application: Used in printed circuit boards (PCBs), flexible electronics, and conductive traces.
- Low-Temperature Substrates:
- Purpose: Allows curing at lower temperatures, ideal for heat-sensitive materials.
- Application: Used with plastics, polymers, and other low-temperature substrates.
- Solar Cells:
- Purpose: Provides highly conductive paths for collecting and transferring electrical energy.
- Application: Used in the production of solar panel electrodes and conductive layers.
- Automotive Electronics:
- Purpose: Durable connections for sensors and control units in harsh environments.
- Application: Used in heating elements, electronic control units (ECUs), and touch interfaces.
- Medical Devices:
- Purpose: Reliable electrical pathways for wearable and diagnostic devices.
- Application: Used in sensors, electrodes, and portable medical equipment.
- Electromagnetic Shielding:
- Purpose: Reduces EMI/RFI interference in electronic systems.
- Application: Used in enclosures and coatings for shielding sensitive components.
- Repair and Prototyping:
- Purpose: Quick and effective repair of broken conductive paths.
- Application: Used to fix damaged PCBs and reconnect conductive traces.
Key Features:
- Low-Temperature Curing: Suitable for heat-sensitive materials, preventing damage during application.
- High Conductivity: Low volume resistivity ensures efficient electrical connections.
- Thermal Stability: Provides durability in high-temperature and high-power applications.
- Ease of Application: Applicable through screen printing, brushing, or syringe dispensing.
- Durable Adhesion: Forms a strong bond with various substrates, including plastics, ceramics, and metals.
- Environmental Resistance: Resistant to oxidation, corrosion, and environmental degradation.
Silver conductive paste with surface curing at 80°C is ideal for applications in electronics, solar energy, automotive, and medical devices, offering reliable conductivity, low-temperature curing, and exceptional durability for advanced technological solutions.
