Tin Nanopowder (Sn, 99.9%, 500nm)

Technical Specifications

1. Product Name: Tin Nanopowder
   • Chemical Formula: Sn
   • CAS Number: 7440-31-5
2. Purity
   • Grade: 99.9% (metal basis)
   • Impurities: ≤0.1% (trace levels of oxides or other metallic/non-metallic elements)
3. Particle Size
   • Range: ~500 nm (submicron scale)
   • Particle Size Distribution: Confirmed using SEM (Scanning Electron Microscopy) or TEM (Transmission Electron Microscopy)
4. Morphology
   • Shape: Near-spherical or irregular particles, depending on synthesis method
   • Surface Area: Higher than bulk materials but lower than smaller nanoparticles (<100 nm)
5. Crystal Structure
   • Phase: Tetragonal (β-tin, stable allotrope at room temperature)
   • Potential Variations: Slight amorphous content may occur depending on production methods
6. Physical and Chemical Properties
   • Color: Grayish metallic powder
   • Density: Lower than bulk tin due to submicron particle agglomeration
   • Melting Point: ~232 °C
   • Boiling Point: ~2,602 °C
   • Conductivity: Excellent electrical and thermal conductivity
7. Packaging and Storage
   • Standard Packaging: Sealed in airtight containers under inert gas (e.g., argon) or vacuum-sealed to prevent oxidation
   • Storage Conditions: Store in a cool, dry environment; protect from air and moisture to minimize oxidation
   • Shelf Life: Stable under proper storage conditions; surface oxidation may develop with prolonged exposure to air
8. Safety and Handling
   • Hazards:
     • Combustible in powder form if exposed to heat or strong oxidizing agents.
     • Tin dust may irritate the respiratory system if inhaled.
   • Recommended Protective Measures:
     • Use PPE (gloves, goggles, respirators).
     • Handle in an inert or controlled environment to minimize risks.

Applications

1. Electronics and Soldering
   • Solder Alloys: Tin nanopowder is widely used in soldering materials for electronics due to its excellent wettability and low melting point.
   • Conductive Coatings: Employed in the production of conductive inks, pastes, and coatings for flexible electronic components.
2. Energy Storage
   • Battery Anodes: Tin nanoparticles are researched for high-capacity anodes in lithium-ion batteries, offering better energy storage performance.
   • Next-Generation Batteries: Suitable for developing advanced sodium-ion and other energy storage systems.
3. Catalysis
   • Chemical Catalysts: Tin acts as a catalyst in hydrogenation and organic reactions, providing high efficiency in chemical processes.
   • Environmental Catalysis: Effective in pollutant removal and chemical waste processing applications.
4. Coatings and Surface Treatments
   • Corrosion Resistance: Tin nanopowder is used in coatings to enhance corrosion resistance, especially in industrial and marine environments.
   • Reflective Coatings: Applied in mirrors and optical devices to improve reflectivity.
5. Nanocomposites
   • Reinforcement Materials: Tin nanoparticles improve the electrical, thermal, and mechanical properties of composite materials.
   • Lightweight Materials: Suitable for aerospace and automotive applications requiring high-strength, lightweight solutions.
6. Additive Manufacturing and 3D Printing
   • Printing Powders: Tin nanopowder is compatible with 3D printing technologies for creating intricate and high-performance metal components.
7. Biomedical Applications (Experimental)
   • Drug Delivery Systems: Studied for its potential use in controlled drug release and targeted delivery.
   • Biosensors: Functionalized tin nanoparticles are employed in the detection of biomolecules with high sensitivity.
8. Optoelectronics and Sensors
   • Infrared Sensors: Tin is used in sensor components for infrared detection systems.
   • Thin-Film Applications: Tin nanopowder is explored for use in thin films for optoelectronic devices.