Tin Nanopowder (Sn, 99.9%, 60-80nm)

Technical Specifications

1. Product Name: Tin Nanopowder
   • Chemical Formula: Sn
   • CAS Number: 7440-31-5
2. Purity
   • Grade: 99.9% (metal basis)
   • Impurities: ≤0.1% (trace levels of oxides or other metallic/non-metallic elements)
3. Particle Size
   • Range: 60–80 nm
   • Particle Size Distribution: Uniformly distributed, confirmed through SEM (Scanning Electron Microscopy) or TEM (Transmission Electron Microscopy)
4. Morphology
   • Shape: Near-spherical or irregular particles, depending on the synthesis method
   • Surface Area: High surface area due to nanoscale size
5. Crystal Structure
   • Phase: Tetragonal (β-tin, the stable allotrope at room temperature)
   • Potential Variations: Minor amorphous phases may exist depending on synthesis conditions
6. Physical and Chemical Properties
   • Color: Grayish metallic powder
   • Density: Bulk density is lower than solid tin due to particle agglomeration
   • Melting Point: ~232 °C
   • Boiling Point: ~2,602 °C
   • Conductivity: High electrical and thermal conductivity
7. Packaging and Storage
   • Standard Packaging: Sealed in airtight containers under inert gas (e.g., argon) or vacuum-sealed to prevent oxidation
   • Storage Conditions: Store in a cool, dry environment; protect from air and moisture to minimize oxidation
   • Shelf Life: Stable under proper storage conditions; surface oxidation may occur with prolonged exposure to air
8. Safety and Handling
   • Hazards:
     • Finely divided tin powder can be combustible under certain conditions.
     • Inhalation of tin dust may irritate the respiratory tract.
   • Recommended Protective Measures:
     • Use appropriate PPE (gloves, goggles, and respirators).
     • Handle in a controlled or inert environment to prevent oxidation or ignition.

Applications

1. Electronics and Soldering
   • Conductive Coatings: Tin nanoparticles are widely used in conductive inks, pastes, and coatings for flexible electronics.
   • Soldering Materials: Due to its low melting point, tin is essential in solder alloys for microelectronics and PCBs.
2. Energy Storage
   • Battery Anodes: Tin nanoparticles are being researched as high-capacity anode materials for lithium-ion batteries, offering better performance than traditional graphite anodes.
   • Advanced Batteries: Utilized in next-generation energy storage solutions, such as sodium-ion batteries.
3. Catalysis
   • Chemical Catalysis: Tin nanoparticles act as catalysts in organic and inorganic reactions, particularly in hydrogenation and reduction reactions.
   • Environmental Catalysis: Effective in removing pollutants or processing chemical waste.
4. Coatings and Surface Treatments
   • Protective Coatings: Tin nanopowder is used to create wear-resistant, corrosion-resistant, and reflective coatings.
   • Thermal Coatings: Improves heat resistance and thermal stability in high-temperature environments.
5. Nanocomposites
   • Reinforced Materials: Tin nanoparticles enhance the electrical, thermal, and mechanical properties of composite materials.
   • Lightweight Components: Used in aerospace and automotive applications for creating high-performance materials.
6. Additive Manufacturing and 3D Printing
   • Advanced Printing Powders: Tin nanopowders are compatible with additive manufacturing processes, allowing the production of intricate and high-performance components.
7. Biomedical Applications (Experimental)
   • Drug Delivery: Tin nanoparticles are being explored for targeted drug delivery systems and nanomedicine.
   • Biosensors: Functionalized tin nanoparticles can be used in biosensors for detecting biological molecules with high sensitivity.
8. Optoelectronics and Sensors
   • Infrared Sensors: Tin’s properties make it suitable for infrared sensor components.
   • Optical Applications: Nanoscale tin can be used in photonic and optoelectronic devices, including thin-film technologies.