Copper Nanopowder ( Cu, 99.9%, 500nm)

Technical Specifications

1. Material Name
   • Product: Copper Nanopowder
   • Chemical Formula: Cu
   • CAS Number: 7440-50-8
2. Purity
   • Grade: 99.9% (metal basis)
   • Impurities: ≤0.1% (trace metal oxides, other metals, or non-metallic elements)
3. Particle Size
   • Average Size: ~500 nm (submicron range)
   • Particle Size Distribution: Typically confirmed by techniques such as SEM (Scanning Electron Microscopy) or TEM (Transmission Electron Microscopy)
4. Morphology
   • Shape: Often near-spherical or irregular, depending on the synthesis method
   • Surface Area: Higher than bulk copper, though less than smaller (<100 nm) nanoparticles due to the larger particle size
5. Crystal Structure
   • Phase: Face-Centered Cubic (fcc)
   • Potential Variations: Minor variations can occur based on production and post-processing conditions
6. Physical and Chemical Properties
   • Color: Reddish metallic powder
   • Bulk Density: Lower than that of fully dense copper, given potential partial agglomeration at the submicron scale
   • Melting Point: ~1,083 °C
   • Boiling Point: ~2,567 °C
   • Conductivity: Copper is known for high electrical and thermal conductivity
7. Packaging and Storage
   • Standard Packaging: Typically sealed under inert gas (e.g., argon) or in vacuum to reduce oxidation
   • Storage Conditions: Store in a cool, dry environment; protect from air and moisture
   • Shelf Life: Stable when properly sealed; oxidation may occur if exposed to air for extended periods
8. Safety and Handling
   • Hazards:
     • Fine or submicron copper particles can be combustible in air under certain conditions
     • Inhalation of copper dust may irritate the respiratory tract
   • Recommended Protective Measures:
     • Wear appropriate personal protective equipment (gloves, goggles, respirators)
     • Handle in an inert or controlled environment to minimize oxidation and fire risks

Applications

1. Electronics and Conductive Inks
   • Conductive Pastes: Used in producing conductive inks and pastes for printed electronics
   • Microelectronics: High conductivity makes copper powder suitable for interconnects and other semiconductor components
2. Catalysis
   • Chemical Synthesis: Copper powders can serve as catalysts in various organic transformations (e.g., coupling reactions)
   • Environmental Catalysis: Potential use in reactions such as CO oxidation or water treatment processes
3. Sensors
   • Gas Sensors: Copper powders enhance sensitivity for gases like H₂S or CO
   • Electrochemical Sensors: Useful in biosensors for detecting analytes such as glucose
4. Metallurgy and Alloying
   • Sintering Aids: Improves densification and mechanical properties in powder metallurgy
   • Advanced Alloys: Enhances conductivity and microstructure in alloy formulations
5. Antimicrobial and Antibacterial Materials
   • Surface Coatings: Copper’s biocidal properties make it suitable for medical devices or high-contact surfaces
   • Filtration: Incorporated into filters to inhibit microbial growth in air or water
6. Thermal Management
   • Heat Sinks: Copper’s high thermal conductivity can be advantageous in submicron composite materials for efficient heat dissipation
   • Nanofluids or Submicron Suspensions: Suspensions containing copper particles may improve heat transfer characteristics

In Summary

Copper Nanopowder (Cu, 99.9%, 500 nm) is a high-purity, submicron form of copper prized for its electrical and thermal conductivity. While it has a lower surface area than smaller (<100 nm) particles, it still offers benefits in applications such as conductive inks, catalysis, antibacterial coatings, and metallurgy. Proper storage and handling in inert or controlled conditions are essential to preserve powder quality and ensure safety.