Copper Nanopowder ( Cu, 99.9%, 40nm)

Technical Specifications

1. Material Name
   • Product: Copper Nanopowder
   • Chemical Formula: Cu
   • CAS Number: 7440-50-8
2. Purity
   • Grade: 99.9% (metal basis)
   • Impurities: ≤0.1% (trace metal oxides, other metals, or non-metallic elements)
3. Particle Size
   • Average Size: ~40 nm
   • Particle Size Distribution: Typically confirmed using SEM (Scanning Electron Microscopy) or TEM (Transmission Electron Microscopy)
4. Morphology
   • Shape: Often near-spherical or irregular, depending on the synthesis route
   • Surface Area: Significantly higher than bulk copper due to nanoscale particle size
5. Crystal Structure
   • Phase: Face-Centered Cubic (fcc)
   • Potential Variations: Minor variations may occur depending on synthesis and post-processing conditions
6. Physical and Chemical Properties
   • Color: Reddish metallic powder
   • Bulk Density: Lower than that of bulk copper, due to agglomeration at the nanoscale
   • Melting Point: ~1,083 °C
   • Boiling Point: ~2,567 °C
   • Conductivity: High electrical and thermal conductivity, characteristic of copper
7. Packaging and Storage
   • Standard Packaging: Typically sealed under inert gas (e.g., argon) or vacuum to minimize oxidation
   • Storage Conditions: Store in a cool, dry environment; protect from air and moisture
   • Shelf Life: Stable if kept sealed; oxidation may occur if exposed to air for extended periods
8. Safety and Handling
   • Hazards:
     • Finely divided copper can be combustible in air under certain conditions
     • Inhalation of copper dust may cause respiratory irritation
   • Recommended Protective Measures:
     • Use appropriate PPE (e.g., gloves, safety goggles, respirators)
     • Handle in an inert atmosphere or under controlled conditions to minimize oxidation and fire risk

Applications

1. Electronics and Conductive Inks
   • Conductive Paste: Copper nanopowder is used in conductive inks, pastes, and coatings for printed electronics
   • Microelectronic Components: High conductivity makes nanoscale copper suitable for interconnects and other semiconductor applications
2. Catalysis
   • Chemical Synthesis: Copper nanoparticles can act as catalysts in various organic reactions (e.g., coupling reactions), offering high surface area
   • Environmental Catalysis: Useful in processes such as CO oxidation or water treatment
3. Sensors
   • Gas Sensing: Nanoscale copper can enhance sensitivity and selectivity for detecting gases like H₂S or CO
   • Electrochemical Sensors: Employed in biosensors for glucose and other analytes
4. Metallurgy and Alloying
   • Sintering Aids: Copper nanostructures help improve densification and mechanical properties in powder metallurgy
   • Advanced Alloys: Enhances conductivity and microstructure when alloyed with other metals
5. Antimicrobial and Antibacterial Materials
   • Surface Coatings: Copper’s biocidal properties are amplified at the nanoscale, making it effective in coatings for medical devices or high-touch surfaces
   • Filtration Systems: Incorporated into water or air filters to inhibit microbial growth
6. Thermal Management
   • Heat Sinks: High thermal conductivity of copper nanoparticles can aid in composite materials for efficient heat dissipation
   • Cooling Fluids: Suspensions (nanofluids) containing copper nanoparticles can improve heat transfer in certain industrial systems

In Summary

Copper Nanopowder (Cu, 99.9%, 40 nm) is a high-purity, nanoscale form of copper with exceptional electrical and thermal properties. Its large surface area and unique reactivity make it valuable across diverse fields, from printed electronics and catalysis to antimicrobial coatings and advanced alloying. Proper storage and handling under inert conditions help preserve its quality and ensure user safety.