Copper Nanopowder ( Cu, 99.9%, 100nm)

Technical Specifications

1. Material Name
   • Product: Copper Nanopowder
   • Chemical Formula: Cu
   • CAS Number: 7440-50-8
2. Purity
   • Grade: 99.9% (metal basis)
   • Impurities: ≤0.1% (trace metal oxides, other metals, or non-metallic elements)
3. Particle Size
   • Average Size: ~100 nm
   • Particle Size Distribution: Typically confirmed via SEM (Scanning Electron Microscopy) or TEM (Transmission Electron Microscopy)
4. Morphology
   • Shape: Often near-spherical or irregular, depending on the synthesis method
   • Surface Area: Significantly higher than bulk copper due to the nanoscale particle size
5. Crystal Structure
   • Phase: Face-Centered Cubic (fcc)
   • Potential Variations: Minor variations can occur based on production and post-processing conditions
6. Physical and Chemical Properties
   • Color: Reddish metallic powder
   • Bulk Density: Lower than that of bulk copper, due to agglomeration at the nanoscale
   • Melting Point: ~1,083 °C
   • Boiling Point: ~2,567 °C
   • Conductivity: High electrical and thermal conductivity (key property of copper)
7. Packaging and Storage
   • Standard Packaging: Typically sealed under inert gas (e.g., argon) or vacuum-sealed to minimize oxidation
   • Storage Conditions: Store in a cool, dry place; protect from air and moisture
   • Shelf Life: Stable when sealed properly; oxidation may occur if exposed to air for long periods
8. Safety and Handling
   • Hazards:
     • Finely divided copper can be combustible in air under certain conditions
     • Inhalation of copper dust may irritate the respiratory tract
   • Recommended Protective Measures:
     • Use appropriate PPE (gloves, safety goggles, respirators)
     • Handle in a controlled atmosphere (e.g., inert gas) to reduce oxidation and fire risks

Applications

1. Electronics and Conductive Inks
   • Conductive Pastes: Copper nanopowder is used to formulate conductive inks and pastes for printed electronics
   • Microelectronic Components: High conductivity makes nanoscale copper suitable for interconnects and other semiconductor applications
2. Catalysis
   • Chemical Synthesis: Copper nanoparticles are employed as catalysts in organic transformations (e.g., coupling reactions) due to their high surface area
   • Environmental Catalysis: Potential use in reactions such as CO oxidation or wastewater treatment processes
3. Sensors
   • Gas Sensors: Nanoscale copper can enhance sensitivity and selectivity for gases like H₂S, CO, and others
   • Electrochemical Sensors: Useful in biosensors for detecting analytes such as glucose
4. Metallurgy and Alloying
   • Sintering Aids: Copper nanoparticles help improve densification and mechanical properties in powder metallurgy
   • Advanced Alloys: Improves conductivity and grain structure in various alloy formulations
5. Antimicrobial and Antibacterial Materials
   • Surface Coatings: Copper’s biocidal properties are enhanced at the nanoscale, making it suitable for medical devices or high-contact surfaces
   • Filtration: Incorporated into water or air filters to inhibit microbial growth
6. Thermal Management
   • Heat Sinks: Copper nanoparticles can be used in composites for efficient heat dissipation
   • Nanofluids: Suspensions containing copper nanoparticles improve heat transfer in coolant or heating systems

In Summary

Copper Nanopowder (Cu, 99.9%, 100 nm) is a high-purity, nanoscale form of copper known for its excellent electrical and thermal conductivity. Its increased surface area and reactivity support a variety of applications, including printed electronics, catalysis, antimicrobial coatings, and alloying. Proper storage and handling under inert conditions are crucial to maintaining quality and ensuring safety.