Copper Nanopowder ( Cu, 99.5%, 800nm)

Technical Specifications

1. Material Name
   • Product: Copper Nanopowder
   • Chemical Formula: Cu
   • CAS Number: 7440-50-8
2. Purity
   • Grade: 99.5% (metal basis)
   • Impurities: ≤0.5% (possible trace metal oxides, other metals, or non-metallic elements)
3. Particle Size
   • Average Size: ~800 nm (submicron range)
   • Particle Size Distribution: Typically determined via SEM (Scanning Electron Microscopy) or TEM (Transmission Electron Microscopy)
4. Morphology
   • Shape: Often near-spherical or irregular, depending on the synthesis method
   • Surface Area: Higher than bulk copper, though less than smaller (<100 nm) nanoparticles
5. Crystal Structure
   • Phase: Face-Centered Cubic (fcc)
   • Variations: Slight variations may occur depending on synthesis and post-processing
6. Physical and Chemical Properties
   • Color: Reddish metallic powder
   • Bulk Density: Typically lower than fully dense copper due to agglomeration in submicron powders
   • Melting Point: ~1,083 °C
   • Boiling Point: ~2,567 °C
   • Conductivity: Copper is known for high electrical and thermal conductivity
7. Packaging and Storage
   • Standard Packaging: Sealed under inert gas (e.g., argon) or vacuum-sealed to reduce oxidation
   • Storage Conditions: Store in a cool, dry place; protect from air and moisture
   • Shelf Life: Stable if sealed properly; oxidation may occur if exposed to air for extended periods
8. Safety and Handling
   • Hazards:
     • Fine or submicron copper can be combustible in air under certain conditions
     • Inhalation of copper dust may cause respiratory irritation
   • Recommended Protective Measures:
     • Wear suitable PPE (gloves, goggles, respirator)
     • Handle in an inert or controlled atmosphere when possible to minimize oxidation and fire risks

Applications

1. Electronics and Conductive Inks
   • Conductive Pastes: Copper nanopowder can be used in inks and pastes for printed electronics
   • Microelectronic Components: High conductivity makes copper suitable for interconnects and other semiconductor elements
2. Catalysis
   • Chemical Reactions: Copper nanoparticles act as catalysts in various organic transformations (e.g., coupling reactions)
   • Environmental Catalysis: Can be used in processes such as CO oxidation or water treatment
3. Sensors
   • Gas Detection: Copper powders can improve sensitivity to gases like H₂S or CO
   • Electrochemical Sensors: Useful in biosensors for detecting analytes such as glucose
4. Metallurgy and Alloying
   • Sintering Aids: Improves densification and mechanical properties in powder metallurgy processes
   • Advanced Alloys: Enhances conductivity and refines microstructure when alloyed with other metals
5. Antimicrobial Materials
   • Surface Coatings: Copper’s antimicrobial properties, even at the submicron scale, help inhibit bacterial growth on high-touch surfaces
   • Filtration: Incorporated into filters for water or air purification systems
6. Thermal Management
   • Heat Dissipation: Copper’s high thermal conductivity benefits applications requiring efficient heat transfer
   • Nanofluids: Copper particles in suspension can improve coolant performance in certain industrial systems

In Summary

Copper Nanopowder (Cu, 99.5%, 800 nm) is a submicron powder with notable electrical and thermal conductivity properties. While it has a somewhat lower surface area compared to smaller (<100 nm) nanoparticles, it still offers key advantages in electronics, catalysis, antimicrobial coatings, and thermal management. Proper handling and storage in an inert or controlled environment help maintain material quality and ensure safe usage.