Copper Micron Powder ( Cu, 325 mesh, Spherical, 99.9% )

Copper Micron Powder (Cu, 325 Mesh, Spherical, 99.9%)

Product Overview

Copper Micron Powder with a 325 mesh particle size, spherical morphology, and a purity of 99.9% is a high-quality metallic powder optimized for applications requiring excellent electrical and thermal conductivity, flowability, and uniformity. Its spherical shape enhances packing density and processability, making it ideal for additive manufacturing, electronics, and energy-related applications.

Key Features

1. High Purity (99.9%):
   • Ensures superior conductivity and consistent performance in precision applications.
2. Spherical Morphology:
   • Promotes excellent flowability, making it ideal for 3D printing and uniform mixing in composites.
3. Fine Particle Size (325 Mesh):
   • Particles smaller than ~44 µm allow for optimal surface area and reactivity.
4. Outstanding Conductivity:
   • Exceptional electrical and thermal properties for high-performance applications.
5. Corrosion Resistance:
   • Provides stability under controlled conditions, ensuring long-term reliability.

Applications

1. Additive Manufacturing and 3D Printing:
   • Utilized in powder bed fusion, binder jetting, and direct metal printing for complex geometries.
2. Electronics:
   • Conductive Inks and Pastes: Used in printed circuits, flexible electronics, and RFID tags.
   • Electrical Contacts: Ensures low resistivity in connectors and switches.
3. Energy Storage and Conversion:
   • Batteries: Enhances conductivity and energy density in lithium-ion and solid-state batteries.
   • Supercapacitors: Improves charge transfer efficiency.
   • Fuel Cells: Acts as a catalyst or conductive support.
4. Thermal Management:
   • Heat Sinks and Spreaders: Ensures efficient heat dissipation in electronics and power devices.
   • Thermally Conductive Composites: Used in polymer and metal matrices for enhanced thermal conductivity.
5. Coatings and Plating:
   • Provides corrosion resistance and decorative finishes in industrial and consumer products.
6. Catalysis:
   • Supports chemical reactions in processes like hydrogen production and carbon dioxide reduction.
7. Powder Metallurgy:
   • Fabricates components with high density and mechanical strength for industrial and automotive use.

Technical Specifications

• Material: Copper (Cu)
• Purity: 99.9%
• Particle Size: 325 Mesh (≤44 µm)
• Morphology: Spherical
• Density: ~8.96 g/cm³
• Melting Point: ~1,085°C
• Thermal Conductivity: ~400 W/m·K
• Electrical Conductivity: ~5.96 × 10⁷ S/m
• Flowability: High, due to spherical shape.

Processing Guidelines

1. Handling:
   • Use appropriate personal protective equipment (PPE), such as gloves and masks, to prevent inhalation or contact.
   • Handle in a clean, dry, and well-ventilated environment to maintain material integrity.
2. Storage:
   • Store in airtight containers away from moisture and oxidizing agents.
   • Keep in a controlled environment to prevent oxidation or contamination.
3. Integration:
   • Uniformly disperses in resins, solvents, or other matrices with mechanical stirring or sonication.

Safety Precautions

1. Inhalation Risks:
   • Fine particles may pose respiratory hazards; ensure proper ventilation and use respiratory protection.
2. Dust Explosion Hazard:
   • Avoid creating dust clouds and handle with grounded equipment to prevent static discharge ignition.
3. Fire and Reactivity:
   • Copper powder is stable but should be kept away from strong oxidizers and open flames.

Current Research and Trends

1. Advanced Manufacturing:
   • Development of copper-based powders for high-resolution 3D printing and additive manufacturing techniques.
2. Renewable Energy:
   • Research into copper’s role in green energy technologies such as hydrogen production and solar cells.
3. Nanoelectronics:
   • Exploration of copper for micro and nano-scale electronic applications due to its excellent conductivity.

Advantages of Copper Micron Powder (325 Mesh, Spherical, 99.9%)

• Optimized Flowability: Spherical particles ensure smooth flow for efficient processing.
• High Conductivity: Delivers exceptional thermal and electrical performance.
• Versatility: Applicable across a wide range of industries, including electronics, energy, and coatings.
• Precision Performance: Fine particle size supports high reactivity and uniform distribution in composites.