Copper Micron Powder ( Cu, 1 µm, 99.99% )

Copper Micron Powder (Cu, 1 µm, 99.99%)

Product Overview

The Copper Micron Powder with a particle size of 1 µm and a high purity of 99.99% is a versatile and highly conductive metallic powder. Its fine particle size and exceptional purity make it ideal for applications in electronics, conductive coatings, advanced manufacturing, and energy storage.

Key Features

1. High Purity (99.99%):
   • Low impurity content ensures excellent electrical and thermal conductivity.
2. Fine Particle Size (1 µm):
   • Provides a high surface area for enhanced reactivity and uniform integration into composites and pastes.
3. Superior Conductivity:
   • Outstanding electrical and thermal performance, making it suitable for high-precision applications.
4. Ductility:
   • Allows for easy processing in various manufacturing techniques.
5. Oxidation Resistance:
   • Excellent stability under controlled environments.

Applications

1. Electronics:
   • Conductive Inks and Pastes: Used in printed circuits, flexible electronics, and RFID tags.
   • Semiconductor Components: Enhances performance in microchips and interconnects.
2. Energy Storage:
   • Batteries: Applied in lithium-ion and other rechargeable battery technologies.
   • Supercapacitors: Improves conductivity for high-efficiency energy storage systems.
3. 3D Printing and Additive Manufacturing:
   • Utilized for fabricating complex geometries in metal-based 3D printing processes.
4. Thermal Management:
   • Heat Sinks and Spreaders: Used in cooling systems for electronics and power devices.
   • Thermal Conductive Composites: Enhances heat dissipation in polymer and metal matrices.
5. Catalysis:
   • Acts as a catalyst in chemical reactions, including hydrogen production and environmental remediation.
6. Medical Applications:
   • Biocompatible copper powder is used in antimicrobial coatings for medical devices.
7. Coatings and Plating:
   • Provides corrosion-resistant and decorative coatings in various industries.

Technical Specifications

• Material: Copper (Cu)
• Purity: 99.99%
• Particle Size: 1 µm (average)
• Density: ~8.96 g/cm³
• Melting Point: ~1,085°C
• Thermal Conductivity: ~400 W/m·K
• Electrical Conductivity: ~5.96 × 10⁷ S/m
• Oxidation Resistance: Excellent in inert or controlled environments.

Processing Guidelines

1. Handling:
   • Use appropriate personal protective equipment (PPE) including gloves, masks, and protective eyewear.
   • Handle in a dry, well-ventilated area to prevent dust accumulation.
2. Storage:
   • Store in a sealed, moisture-free container to avoid oxidation and contamination.
   • Keep away from strong oxidizers and acids.
3. Dispersion:
   • Uniformly disperses in solvents, resins, and matrices with mechanical or ultrasonic mixing.

Safety Precautions

1. Inhalation Risks:
   • Fine copper powder can pose respiratory risks; ensure proper ventilation.
2. Dust Explosion Hazard:
   • Avoid creating dust clouds in confined spaces; handle with grounded equipment to reduce static discharge risks.
3. Fire and Reactivity:
   • While copper is stable, fine particles can react with strong oxidizers at elevated temperatures.

Current Research and Trends

1. Advanced Electronics:
   • Research into ultra-thin copper films for next-generation microelectronics.
2. Sustainable Energy:
   • Development of copper-based electrodes for green hydrogen production and renewable energy storage.
3. Antimicrobial Technologies:
   • Expanding applications in healthcare and public spaces for infection control.
4. Nanotechnology:
   • Copper nanoparticles are being explored for enhanced catalytic and conductive properties.

Advantages of Copper Micron Powder (1 µm, 99.99%)

• Exceptional Conductivity: Delivers high electrical and thermal performance for precision applications.
• Versatility: Adapts to a wide range of industrial and technological uses.
• High Purity: Ensures consistent quality and reliable results.
• Ease of Processing: Fine particle size facilitates dispersion and integration into various systems.