Technical Specifications:
- Structure:
- Width: Typically ranges from a few nanometers to micrometers.
- Thickness: Dependent on the parent CNT diameter and unzipping method.
- High aspect ratio and flat, ribbon-like morphology.
- Electrical Conductivity:
- Comparable to graphene or CNTs, typically 10⁵–10⁶ S/m.
- Thermal Conductivity:
- High thermal conductivity, often exceeding 200–500 W/m·K, depending on ribbon quality.
- Mechanical Properties:
- Tensile strength: Similar to CNTs, in the range of 10–50 GPa.
- Flexibility: Retains significant mechanical flexibility with high strength.
- Functionalization:
- Can be chemically functionalized with -COOH, -OH, or other groups for enhanced dispersibility and reactivity.
- Processing:
- Produced through oxidative or mechanical unzipping of CNTs or direct synthesis using CVD methods.
Applications:
- Electronics:
- Nanoscale interconnects and conductive pathways.
- Flexible and stretchable electronics.
- Energy Storage:
- Electrodes for lithium-ion batteries and supercapacitors.
- Catalyst supports in fuel cells.
- Composites:
- Structural reinforcement in polymers, metals, or ceramics.
- Conductive composites for EMI shielding or sensors.
- Sensors:
- High-sensitivity chemical and biological sensors due to tunable functionalization.
- Thermal Management:
- Heat dissipation materials in microelectronics.
- Biomedical:
- Potential use in drug delivery systems and bioengineering applications.