Carbon Black & Carbon Nanotube Mixed, Purity: >97.5%

Technical Specifications:

1. Composition:
   • A mixture of Carbon Black (CB) and Carbon Nanotubes (CNTs), optimized for specific applications.
   • Purity: >97.5%, ensuring minimal impurities for high-performance applications.
2. Carbon Black Properties:
   • Particle Size: Typically 10–500 nm.
   • Surface Area: 50–1500 m²/g, depending on grade.
   • High conductivity and reinforcement capabilities.
3. Carbon Nanotube Properties:
   • Type: Single-walled (SWCNTs) or Multi-walled (MWCNTs).
   • Diameter: 1–50 nm.
   • Length: 1–20 μm.
   • Excellent electrical/thermal conductivity, tensile strength, and aspect ratio.
4. Blend Characteristics:
   • Combines the high conductivity and mechanical strength of CNTs with the dispersion and cost-efficiency of carbon black.
   • Improves performance in electrical, thermal, and reinforcement applications.
5. Electrical Conductivity:
   • Enhanced compared to pure carbon black, typically 10⁵–10⁷ S/m, depending on CNT content.
6. Thermal Conductivity:
   • Improved heat dissipation compared to standalone carbon black, exceeding 200 W/m·K.
7. Density:
   • Varies with mixing ratio, typically 1.8–2.2 g/cm³.
8. Functionalization:
   • Optional chemical modifications (-COOH, -OH) to improve compatibility with polymers or dispersion in solvents.

Applications:

1. Rubber and Plastics:
   • Used as a reinforcing agent in tires, seals, and polymer composites to enhance durability and conductivity.
2. Electrodes:
   • Ideal for supercapacitors, batteries, and fuel cells, combining high conductivity with structural support.
3. Conductive Inks and Coatings:
   • Improves electrical and thermal performance in flexible and printed electronics.
4. Thermal Management:
   • Used in heat-dissipating materials for electronics and industrial systems.
5. Catalyst Supports:
   • Provides a high surface area for catalytic reactions in chemical and energy systems.
6. EMI Shielding:
   • Effective in electromagnetic interference (EMI) shielding applications due to high conductivity and lightweight properties.
7. Sensors:
   • Incorporated in gas and liquid sensors for enhanced sensitivity and faster response times.
8. Composite Materials:
   • Integrated into polymer, ceramic, or metal matrices for structural, thermal, and electrical enhancements.