Copper Nanopowder ( Cu, 99.9%, 70nm )

Technical Specifications

1. Material Name
   • Product: Copper Nanopowder
   • Chemical Formula: Cu
   • CAS Number: 7440-50-8
2. Purity
   • Grade: 99.9% (metal basis)
   • Impurities: ≤0.1% (trace metal oxides, other metals, or non-metallic elements)
3. Particle Size
   • Average Size: ~70 nm
   • Particle Size Distribution: Typically confirmed using SEM (Scanning Electron Microscopy) or TEM (Transmission Electron Microscopy)
4. Morphology
   • Shape: Often near-spherical or irregular, depending on the synthesis process
   • Surface Area: Significantly higher than bulk copper due to the nanoscale particle size
5. Crystal Structure
   • Phase: Face-Centered Cubic (fcc)
   • Potential Variations: Minor variations may occur depending on synthesis and post-processing methods
6. Physical and Chemical Properties
   • Color: Reddish metallic powder
   • Bulk Density: Lower than that of bulk copper, given potential agglomeration at the nanoscale
   • Melting Point: ~1,083 °C
   • Boiling Point: ~2,567 °C
   • Conductivity: High electrical and thermal conductivity, characteristic of copper
7. Packaging and Storage
   • Standard Packaging: Typically sealed under inert gas (e.g., argon) or vacuum-sealed to reduce oxidation
   • Storage Conditions: Store in a cool, dry place; protect from air and moisture
   • Shelf Life: Stable if sealed properly; oxidation may occur if exposed to air for extended periods
8. Safety and Handling
   • Hazards:
     • Finely divided copper can be combustible in air under certain conditions
     • Inhalation of copper dust may cause respiratory irritation
   • Recommended Protective Measures:
     • Use appropriate PPE (e.g., gloves, safety goggles, respirators)
     • Handle in an inert atmosphere or under controlled conditions to minimize oxidation and fire risk

Applications

1. Electronics and Conductive Inks
   • Conductive Pastes: Copper nanopowder is used in conductive inks and pastes for printed electronics
   • Microelectronics: High conductivity makes copper nanoparticles suitable for interconnects and other semiconductor applications
2. Catalysis
   • Chemical Synthesis: Copper nanoparticles can serve as catalysts in various organic transformations (e.g., coupling reactions) due to high surface area
   • Environmental Catalysis: Can be used in reactions such as CO oxidation or in water treatment processes
3. Sensors
   • Gas Sensors: Nanoscale copper can improve sensitivity and selectivity, particularly for detecting gases like H₂S or CO
   • Electrochemical Sensors: Useful in biosensor applications for analytes like glucose
4. Metallurgy and Alloying
   • Sintering Aids: Copper nanoparticles can improve densification and mechanical properties in powder metallurgy processes
   • Advanced Alloys: Helps enhance conductivity and refine microstructures in alloyed systems
5. Antimicrobial and Antibacterial Materials
   • Surface Coatings: Copper’s biocidal properties, amplified at the nanoscale, make it effective in coatings for medical devices and frequently touched surfaces
   • Filtration Systems: Incorporated into filter media to inhibit microbial growth in water or air purification
6. Thermal Management
   • Heat Sinks: High thermal conductivity of copper nanoparticles can assist in composite materials designed for efficient heat dissipation
   • Nanofluids: Suspensions containing copper nanoparticles can enhance heat transfer in certain cooling applications

In Summary

Copper Nanopowder (Cu, 99.9%, 70 nm) is a high-purity, nanoscale form of copper with notable electrical and thermal conductivity. Its large surface area and reactive properties enable diverse applications, ranging from printed electronics and catalysis to antimicrobial coatings and advanced alloying. Proper storage and handling under inert or controlled conditions are essential to preserve its quality and maintain safety.